Investigation of SiO_xC_y film as the encapsulation layer for full transparent OLED using hollow cathode discharge plasma at room temperature

The plasma polymer of SiO_xC_y film has attracted much attention because it could possess both the organic and inorganic properties simultaneously for wide range applications. In this work, a SiO _xC_y film with a gradient composition through tuning the N₂O/N₂O + Ar ratio from 0% to 100% was used for TOLED encapsulation using hollow cathode discharge plasma. In order to confirm whether the plasma damage was caused during the PECVD process, a ZnO buffer layer prepared using RF sputtering was deposited before encapsulation. Furthermore, the reference samples with glass lid encapsulation were also used for comparison. The results showed that the SiO_xC_y film with a gradient composition cooperated with the sputtering ZnO buffer layer was a simple and effective method for TOLED encapsulation.