Localization of NBT hot carrier-induced oxide damage in SOI pMOSFET's

Chao Sung Lai*, Shih Cheng Hung, Jam Wem Lee, Steve S. Chung

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The NBTI-like HC degradation of the SOI pMOSFET's was investigated. The generated Nit inside the channel region is the dominant mechanism of NBTI for SOI pMOSFET's due to the poor thermal conductivity of buried oxide. However, for the NBTI-like HC stressing, the generated Nit inside the drain and source region is dominant due to the combined HC and NBTI, respectively. The hole trapping model was proposed to explain both the electron and hole component increases during stressing and the activation energy has also been extracted. It was observed that NBTI-like stress was the worst case degradation in SOI pMOSFET's.

Original languageEnglish
Title of host publication2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual
Pages710-711
Number of pages2
StatePublished - 2005
Event2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual - San Jose, CA, United States
Duration: 17 04 200521 04 2005

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Conference

Conference2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual
Country/TerritoryUnited States
CitySan Jose, CA
Period17/04/0521/04/05

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