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Low-Mg out-diffusion of a normally off p-GaN gate high-electron-mobility transistor by using the laser activation technique

  • Hsien Chin Chiu*
  • , Chia Hao Liu
  • , Hsuan Ling Kao
  • , Hsiang Chun Wang
  • , Chong Rong Huang
  • , Chao Wei Chiu
  • , Chih Tien Chen
  • , Kuo Jen Chang
  • *Corresponding author for this work
  • Chang Gung Memorial Hospital
  • Ming Chi University of Technology
  • Chang Gung University
  • Chung-shan Institute of Science and Technology Taiwan

Research output: Contribution to journal › Journal Article › peer-review

14 Scopus citations

Abstract

A low- Magnesium (Mg) out-diffusion normally off p-GaN gated AlGaN/GaN high-electron-mobility transistor (HEMT) was developed using a low-temperature laser activation technique. Conventionally, during the actual p-GaN layer activation procedure, Mg out-diffuses into the AlGaN barrier and GaN channel at high temperatures. In addition, the Al of the AlGaN barrier layer is injected into GaN to generate alloy scattering and to suppress current density. In this study, the GaN doped Mg layer (Mg:GaN)was activated using short-wavelength Nd:YAG pulse laser annealing, and a conventional thermal activation device was processed for comparison. The results demonstrated that the laser activation technique in p-GaN HEMT suppressed the Mg out-diffusion-induced leakage current and trapping effect and enhanced the current density and breakdown voltage. Therefore, using this novel technique, a high and active Mg concentration and a favorable doping confinement can be obtained in the p-GaN layer to realize a stable enhancement-mode operation.

Original languageEnglish
Article number105166
JournalMaterials Science in Semiconductor Processing
Volume117
DOIs
StatePublished - 10 2020

Bibliographical note

Publisher Copyright:
© 2020 Elsevier Ltd

Keywords

  • Drain lag
  • Laser activation
  • Normally off
  • p-GaN gate HEMT

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