Low temperature wafer bonding process using sol-gel intermediate layer

S.S. Deng, S.M.L. Nai, Cher-Ming Tan, J. Wei, C.K. Wong, W.B. Yu

Research output: Contribution to journal › Journal Article › peer-review

Original language	American English
Pages (from-to)	309-314
Journal	American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Volume	4
State	Published - 2004

Cite this

@article{7423235aeb75463f9f599a3625529eec,

title = "Low temperature wafer bonding process using sol-gel intermediate layer",

author = "S.S. Deng and S.M.L. Nai and Cher-Ming Tan and J. Wei and C.K. Wong and W.B. Yu",

year = "2004",

language = "American English",

volume = "4",

pages = "309--314",

journal = "American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP",

issn = "1071-6947",

}

TY - JOUR

T1 - Low temperature wafer bonding process using sol-gel intermediate layer

AU - Deng, S.S.

AU - Nai, S.M.L.

AU - Tan, Cher-Ming

AU - Wei, J.

AU - Wong, C.K.

AU - Yu, W.B.

PY - 2004

Y1 - 2004

M3 - Journal Article

SN - 1071-6947

VL - 4

SP - 309

EP - 314

JO - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

JF - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

ER -