LTCC dual-band stepped-impedance-stub filter constructed with vertically folded structure

K. S. Chin; J. L. Hung; C. W. Huang; J. S. Fu; B. G. Chen; T. J. Chen

doi:10.1049/el.2010.2347

LTCC dual-band stepped-impedance-stub filter constructed with vertically folded structure

K. S. Chin^*, J. L. Hung, C. W. Huang, J. S. Fu, B. G. Chen, T. J. Chen

^*Corresponding author for this work

Department of Electronic Engineering

Chang Gung University

Research output: Contribution to journal › Journal Article › peer-review

15 Scopus citations

Abstract

Dual-band filtiers are common in dual-band transceivers, to attenuate interfering signals, and transmit the main signal in the desired passband. Reported is a compact low-temperature co-fired ceramic (LTCC) dual-band filter, constructed with a vertically folded structure and stepped-impedance stubs. The novel vertical interconnection scheme with its multilayered structure reduces the area of the filter by half. A 2.4/5.8GHz dual-band experimental filter has been designed and assembled to verify the proposed design concept. S-parameter test results demonstrated good agreement between simulation and measurement.

Original language	English
Pages (from-to)	1554-1556
Number of pages	3
Journal	Electronics Letters
Volume	46
Issue number	23
DOIs	https://doi.org/10.1049/el.2010.2347
State	Published - 11 11 2010

Access to Document

10.1049/el.2010.2347

Cite this

@article{483486a440534457aa28b90fc3bffc4b,

title = "LTCC dual-band stepped-impedance-stub filter constructed with vertically folded structure",

abstract = "Dual-band filtiers are common in dual-band transceivers, to attenuate interfering signals, and transmit the main signal in the desired passband. Reported is a compact low-temperature co-fired ceramic (LTCC) dual-band filter, constructed with a vertically folded structure and stepped-impedance stubs. The novel vertical interconnection scheme with its multilayered structure reduces the area of the filter by half. A 2.4/5.8GHz dual-band experimental filter has been designed and assembled to verify the proposed design concept. S-parameter test results demonstrated good agreement between simulation and measurement.",

author = "Chin, \{K. S.\} and Hung, \{J. L.\} and Huang, \{C. W.\} and Fu, \{J. S.\} and Chen, \{B. G.\} and Chen, \{T. J.\}",

year = "2010",

month = nov,

day = "11",

doi = "10.1049/el.2010.2347",

language = "英语",

volume = "46",

pages = "1554--1556",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "John Wiley \& Sons Inc.",

number = "23",

}

TY - JOUR

T1 - LTCC dual-band stepped-impedance-stub filter constructed with vertically folded structure

AU - Chin, K. S.

AU - Hung, J. L.

AU - Huang, C. W.

AU - Fu, J. S.

AU - Chen, B. G.

AU - Chen, T. J.

PY - 2010/11/11

Y1 - 2010/11/11

N2 - Dual-band filtiers are common in dual-band transceivers, to attenuate interfering signals, and transmit the main signal in the desired passband. Reported is a compact low-temperature co-fired ceramic (LTCC) dual-band filter, constructed with a vertically folded structure and stepped-impedance stubs. The novel vertical interconnection scheme with its multilayered structure reduces the area of the filter by half. A 2.4/5.8GHz dual-band experimental filter has been designed and assembled to verify the proposed design concept. S-parameter test results demonstrated good agreement between simulation and measurement.

AB - Dual-band filtiers are common in dual-band transceivers, to attenuate interfering signals, and transmit the main signal in the desired passband. Reported is a compact low-temperature co-fired ceramic (LTCC) dual-band filter, constructed with a vertically folded structure and stepped-impedance stubs. The novel vertical interconnection scheme with its multilayered structure reduces the area of the filter by half. A 2.4/5.8GHz dual-band experimental filter has been designed and assembled to verify the proposed design concept. S-parameter test results demonstrated good agreement between simulation and measurement.

UR - https://www.scopus.com/pages/publications/78449308876

U2 - 10.1049/el.2010.2347

DO - 10.1049/el.2010.2347

M3 - 文章

AN - SCOPUS:78449308876

SN - 0013-5194

VL - 46

SP - 1554

EP - 1556

JO - Electronics Letters

JF - Electronics Letters

IS - 23

ER -

LTCC dual-band stepped-impedance-stub filter constructed with vertically folded structure

Abstract

Access to Document

Other files and links

Fingerprint

Cite this