@inproceedings{3164688640cb481c89429522bed8e8ff,
title = "Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD",
abstract = "The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages in 45×32 mm TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages(or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.",
author = "Tsai, {M. Y.} and Huang, {C. Y.} and Ding, {C. W.} and Kao, {Kuo Shu} and Chen, {Ming Yao} and Jimmy Tsang and Yang, {Sheng Shu} and An, {Cho Chyun} and Chang, {Shyh Ming}",
year = "2007",
language = "英语",
isbn = "9789572852248",
series = "IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings",
pages = "98--101",
booktitle = "IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings",
note = "International Display Manufacturing Conference and Exhibition, IDMC 2007 ; Conference date: 03-07-2007 Through 06-07-2007",
}