Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD

M. Y. Tsai; C. Y. Huang; C. W. Ding; Kuo Shu Kao; Ming Yao Chen; Jimmy Tsang; Sheng Shu Yang; Cho Chyun An; Shyh Ming Chang

Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD

M. Y. Tsai
, C. Y. Huang
, C. W. Ding
, Kuo Shu Kao
, Ming Yao Chen
, Jimmy Tsang
, Sheng Shu Yang
, Cho Chyun An
, Shyh Ming Chang

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages in 45×32 mm TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages(or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

Original language	English
Title of host publication	IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings
Pages	98-101
Number of pages	4
State	Published - 2007
Event	International Display Manufacturing Conference and Exhibition, IDMC 2007 - Taipei, Taiwan Duration: 03 07 2007 → 06 07 2007

Publication series

Name	IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings

Conference

Conference	International Display Manufacturing Conference and Exhibition, IDMC 2007
Country/Territory	Taiwan
City	Taipei
Period	03/07/07 → 06/07/07

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Cite this

Tsai, M. Y., Huang, C. Y., Ding, C. W., Kao, K. S., Chen, M. Y., Tsang, J., Yang, S. S., An, C. C., & Chang, S. M. (2007). Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD. In IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings (pp. 98-101). (IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings).

@inproceedings{3164688640cb481c89429522bed8e8ff,

title = "Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD",

abstract = "The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages in 45×32 mm TFT-LCD after bonding fabrication, thermal shock and 85°C/85\%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages(or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.",

author = "Tsai, \{M. Y.\} and Huang, \{C. Y.\} and Ding, \{C. W.\} and Kao, \{Kuo Shu\} and Chen, \{Ming Yao\} and Jimmy Tsang and Yang, \{Sheng Shu\} and An, \{Cho Chyun\} and Chang, \{Shyh Ming\}",

year = "2007",

language = "英语",

isbn = "9789572852248",

series = "IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings",

pages = "98--101",

booktitle = "IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings",

note = "International Display Manufacturing Conference and Exhibition, IDMC 2007 ; Conference date: 03-07-2007 Through 06-07-2007",

}

Tsai, MY, Huang, CY, Ding, CW, Kao, KS, Chen, MY, Tsang, J, Yang, SS, An, CC & Chang, SM 2007, Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD. in IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings. IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings, pp. 98-101, International Display Manufacturing Conference and Exhibition, IDMC 2007, Taipei, Taiwan, 03/07/07.

Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD. / Tsai, M. Y.; Huang, C. Y.; Ding, C. W. et al.
IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings. 2007. p. 98-101 (IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD

AU - Tsai, M. Y.

AU - Huang, C. Y.

AU - Ding, C. W.

AU - Kao, Kuo Shu

AU - Chen, Ming Yao

AU - Tsang, Jimmy

AU - Yang, Sheng Shu

AU - An, Cho Chyun

AU - Chang, Shyh Ming

PY - 2007

Y1 - 2007

N2 - The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages in 45×32 mm TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages(or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

AB - The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages in 45×32 mm TFT-LCD after bonding fabrication, thermal shock and 85°C/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316μm/fringe. The full-field warpages(or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

UR - https://www.scopus.com/pages/publications/56049113522

M3 - 会议稿件

AN - SCOPUS:56049113522

SN - 9789572852248

T3 - IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings

SP - 98

EP - 101

BT - IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings

T2 - International Display Manufacturing Conference and Exhibition, IDMC 2007

Y2 - 3 July 2007 through 6 July 2007

ER -

Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD

Abstract

Publication series

Conference

UN SDGs

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