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Measurement of manufacturing- and hydrothermal-induced warpages for ACF-bonded COG package in TFT-LCD
M. Y. Tsai, C. Y. Huang, C. W. Ding, Kuo Shu Kao, Ming Yao Chen, Jimmy Tsang, Sheng Shu Yang, Cho Chyun An, Shyh Ming Chang
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review