Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes

Ming Yi Tsai*, Yu Wen Wang, Yen Jui Lu, Tzu Min Lu, Shu Tan Chung

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

4 Scopus citations

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Physics

Engineering