Mechanical properties of TaN-Cu nanocomposite thin films

J. H. Hsieh; P. C. Liu; C. Li; M. K. Cheng; S. Y. Chang

doi:10.1016/j.surfcoat.2008.06.131

Mechanical properties of TaN-Cu nanocomposite thin films

J. H. Hsieh^*, P. C. Liu, C. Li, M. K. Cheng, S. Y. Chang

^*Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

28 Scopus citations

Abstract

TaN-Cu nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Cu particles in the TaN matrix and on the film surface. Indentation method was used to examine the mechanical properties of these films. The results confirm that annealing by RTA can cause Cu nano-particles with various dimensions to form on and in the TaN matrix. Consequently, hardness and toughness will change depending on annealing conditions, Cu content, and/or Cu particle density. The strengthening and toughening mechanisms are discussed.

Original language	English
Pages (from-to)	5530-5534
Number of pages	5
Journal	Surface and Coatings Technology
Volume	202
Issue number	22-23
DOIs	https://doi.org/10.1016/j.surfcoat.2008.06.131
State	Published - 30 08 2008
Externally published	Yes

Keywords

Annealing
Co-sputtering
Nanocomposite thin films
TaN-Cu

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10.1016/j.surfcoat.2008.06.131

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title = "Mechanical properties of TaN-Cu nanocomposite thin films",

abstract = "TaN-Cu nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Cu particles in the TaN matrix and on the film surface. Indentation method was used to examine the mechanical properties of these films. The results confirm that annealing by RTA can cause Cu nano-particles with various dimensions to form on and in the TaN matrix. Consequently, hardness and toughness will change depending on annealing conditions, Cu content, and/or Cu particle density. The strengthening and toughening mechanisms are discussed.",

keywords = "Annealing, Co-sputtering, Nanocomposite thin films, TaN-Cu",

author = "Hsieh, {J. H.} and Liu, {P. C.} and C. Li and Cheng, {M. K.} and Chang, {S. Y.}",

year = "2008",

month = aug,

day = "30",

doi = "10.1016/j.surfcoat.2008.06.131",

language = "英语",

volume = "202",

pages = "5530--5534",

journal = "Surface and Coatings Technology",

issn = "0257-8972",

publisher = "Elsevier B.V.",

number = "22-23",

}

TY - JOUR

T1 - Mechanical properties of TaN-Cu nanocomposite thin films

AU - Hsieh, J. H.

AU - Liu, P. C.

AU - Li, C.

AU - Cheng, M. K.

AU - Chang, S. Y.

PY - 2008/8/30

Y1 - 2008/8/30

N2 - TaN-Cu nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Cu particles in the TaN matrix and on the film surface. Indentation method was used to examine the mechanical properties of these films. The results confirm that annealing by RTA can cause Cu nano-particles with various dimensions to form on and in the TaN matrix. Consequently, hardness and toughness will change depending on annealing conditions, Cu content, and/or Cu particle density. The strengthening and toughening mechanisms are discussed.

AB - TaN-Cu nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Cu particles in the TaN matrix and on the film surface. Indentation method was used to examine the mechanical properties of these films. The results confirm that annealing by RTA can cause Cu nano-particles with various dimensions to form on and in the TaN matrix. Consequently, hardness and toughness will change depending on annealing conditions, Cu content, and/or Cu particle density. The strengthening and toughening mechanisms are discussed.

KW - Annealing

KW - Co-sputtering

KW - Nanocomposite thin films

KW - TaN-Cu

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U2 - 10.1016/j.surfcoat.2008.06.131

DO - 10.1016/j.surfcoat.2008.06.131

M3 - 文章

AN - SCOPUS:50349091151

SN - 0257-8972

VL - 202

SP - 5530

EP - 5534

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

IS - 22-23

ER -

Mechanical properties of TaN-Cu nanocomposite thin films

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Keywords

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