Mechanically strained Si-SiGe HBTs

  • F. Yuan*
  • , S. R. Jan
  • , S. Maikap
  • , Y. H. Liu
  • , C. S. Liang
  • , C. W. Liu
  • *Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

16 Scopus citations

Abstract

The current gain (β = IC/IB) variations of the mechanically strained Si-SiGe heterojunction bipolar transistor (HBT and Si bipolar junction transistor (BJT) devices are investigated experimentally and theoretically. The β change of HBT is found to be 4.2% and -7.8% under the biaxial compressive and tensile mechanical strain of 0.028%, respectively. For comparison, there are 4.9% and -5.0% β variations for BJT under the biaxial compressive and tensile mechanical strain of 0.028%, respectively. In HBT, the mechanical stress is-competing with the compressive strain of SiGe base, inherited from the lattice misfit between SiGe and Si. The current change due to externally mechanical stress is the combinational effects of the dependence of the mobility and the intrinsic carrier concentration on strain.

Original languageEnglish
Pages (from-to)483-485
Number of pages3
JournalIEEE Electron Device Letters
Volume25
Issue number7
DOIs
StatePublished - 07 2004
Externally publishedYes

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