Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station

Bo Siang Fang; Kuan Ta Chen; Cha Chu Lai; Jui Ching Cheng

doi:10.1109/EPTC.2018.8654372

Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station

Bo Siang Fang^*, Kuan Ta Chen, Cha Chu Lai, Jui Ching Cheng

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The antenna in package (AiP) designed in millimeter wave (mm wave) bands induces the outsourced semiconductor assembly and test (OSAT) industry as a newcomer to build the capability to test antenna over the air (OTA). According to the features of the mm wave AiP that are small size, highly directional radiation and probe-contacted interface, the OTA environment can be specialized to be a vertical probe station with 85cm distance to keep far field radiation that ensures high dynamic range of system and the wide size of package to be tested. The proposed vertical probe station will be used not only in the early stage of product development, but also in the sampling inspection during high volume mass (HVM) production. In this paper, the mechanical and electrical schematic drawing of the proposed probe station were revealed. And the calibration method of it was also presented. An experimental instance was given to demonstrate the accuracy of the system by comparing the measurements in between it and a standard anechoic chamber. The differences were only 0.3 dB in antenna gain and 0.75 degree in beamwidth.

Original language	English
Title of host publication	2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	519-523
Number of pages	5
ISBN (Electronic)	9781538676684
DOIs	https://doi.org/10.1109/EPTC.2018.8654372
State	Published - 12 2018
Externally published	Yes
Event	20th IEEE Electronics Packaging Technology Conference, EPTC 2018 - Singapore, Singapore Duration: 04 12 2018 → 07 12 2018

Publication series

Name	2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018

Conference

Conference	20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Country/Territory	Singapore
City	Singapore
Period	04/12/18 → 07/12/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Access to Document

10.1109/EPTC.2018.8654372

Cite this

Fang, B. S., Chen, K. T., Lai, C. C., & Cheng, J. C. (2018). Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station. In 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018 (pp. 519-523). Article 8654372 (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2018.8654372

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title = "Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station",

abstract = "The antenna in package (AiP) designed in millimeter wave (mm wave) bands induces the outsourced semiconductor assembly and test (OSAT) industry as a newcomer to build the capability to test antenna over the air (OTA). According to the features of the mm wave AiP that are small size, highly directional radiation and probe-contacted interface, the OTA environment can be specialized to be a vertical probe station with 85cm distance to keep far field radiation that ensures high dynamic range of system and the wide size of package to be tested. The proposed vertical probe station will be used not only in the early stage of product development, but also in the sampling inspection during high volume mass (HVM) production. In this paper, the mechanical and electrical schematic drawing of the proposed probe station were revealed. And the calibration method of it was also presented. An experimental instance was given to demonstrate the accuracy of the system by comparing the measurements in between it and a standard anechoic chamber. The differences were only 0.3 dB in antenna gain and 0.75 degree in beamwidth.",

author = "Fang, {Bo Siang} and Chen, {Kuan Ta} and Lai, {Cha Chu} and Cheng, {Jui Ching}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 20th IEEE Electronics Packaging Technology Conference, EPTC 2018 ; Conference date: 04-12-2018 Through 07-12-2018",

year = "2018",

month = dec,

doi = "10.1109/EPTC.2018.8654372",

language = "英语",

series = "2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Fang, BS, Chen, KT, Lai, CC & Cheng, JC 2018, Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station. in 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018., 8654372, 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018, Institute of Electrical and Electronics Engineers Inc., pp. 519-523, 20th IEEE Electronics Packaging Technology Conference, EPTC 2018, Singapore, Singapore, 04/12/18. https://doi.org/10.1109/EPTC.2018.8654372

Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station. / Fang, Bo Siang; Chen, Kuan Ta; Lai, Cha Chu et al.
2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 519-523 8654372 (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station

AU - Fang, Bo Siang

AU - Chen, Kuan Ta

AU - Lai, Cha Chu

AU - Cheng, Jui Ching

PY - 2018/12

Y1 - 2018/12

N2 - The antenna in package (AiP) designed in millimeter wave (mm wave) bands induces the outsourced semiconductor assembly and test (OSAT) industry as a newcomer to build the capability to test antenna over the air (OTA). According to the features of the mm wave AiP that are small size, highly directional radiation and probe-contacted interface, the OTA environment can be specialized to be a vertical probe station with 85cm distance to keep far field radiation that ensures high dynamic range of system and the wide size of package to be tested. The proposed vertical probe station will be used not only in the early stage of product development, but also in the sampling inspection during high volume mass (HVM) production. In this paper, the mechanical and electrical schematic drawing of the proposed probe station were revealed. And the calibration method of it was also presented. An experimental instance was given to demonstrate the accuracy of the system by comparing the measurements in between it and a standard anechoic chamber. The differences were only 0.3 dB in antenna gain and 0.75 degree in beamwidth.

AB - The antenna in package (AiP) designed in millimeter wave (mm wave) bands induces the outsourced semiconductor assembly and test (OSAT) industry as a newcomer to build the capability to test antenna over the air (OTA). According to the features of the mm wave AiP that are small size, highly directional radiation and probe-contacted interface, the OTA environment can be specialized to be a vertical probe station with 85cm distance to keep far field radiation that ensures high dynamic range of system and the wide size of package to be tested. The proposed vertical probe station will be used not only in the early stage of product development, but also in the sampling inspection during high volume mass (HVM) production. In this paper, the mechanical and electrical schematic drawing of the proposed probe station were revealed. And the calibration method of it was also presented. An experimental instance was given to demonstrate the accuracy of the system by comparing the measurements in between it and a standard anechoic chamber. The differences were only 0.3 dB in antenna gain and 0.75 degree in beamwidth.

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ER -

Fang BS, Chen KT, Lai CC, Cheng JC. Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station. In 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 519-523. 8654372. (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018). doi: 10.1109/EPTC.2018.8654372

Millimeter wave antenna in package (AIP) measured in far-field by a vertical probe station

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