TY - GEN
T1 - Miniaturization design for planar hybrid ring couplers
AU - Yi-Chyun, Chiou
AU - Cheng-Hsiu, Tsai
AU - Juo-Shiuan, Wu
AU - Jen-Tsai, Kuo
PY - 2008
Y1 - 2008
N2 - Miniaturization of a microstrip rat race coupler is implemented by three approaches. First, a new rat race hybrid design is devised for circuit miniaturization based on the periodic stepped-impedance ring structure. The circuit has a normalized area of 21.5%. In the second approach, miniaturization is carried out by incorporating a broadside-coupled structure and steppedimpedance sections into the design. The former is used to replace the 3λ/4-section and the latter is to substitute each λ/4-section in the regular 6λ/4 circuits. As a result, one of the circuits occupies only 18% of the area of a traditional rat race. Finally, a general synthesis is performed to design reduced-length rat race rings. Incorporating the stepped-impedance configuration, the normalized circuit area is 13.12% of a 6λ/4-ring. All the designs are validated by comparing measured four-port parameters with the simulated results.
AB - Miniaturization of a microstrip rat race coupler is implemented by three approaches. First, a new rat race hybrid design is devised for circuit miniaturization based on the periodic stepped-impedance ring structure. The circuit has a normalized area of 21.5%. In the second approach, miniaturization is carried out by incorporating a broadside-coupled structure and steppedimpedance sections into the design. The former is used to replace the 3λ/4-section and the latter is to substitute each λ/4-section in the regular 6λ/4 circuits. As a result, one of the circuits occupies only 18% of the area of a traditional rat race. Finally, a general synthesis is performed to design reduced-length rat race rings. Incorporating the stepped-impedance configuration, the normalized circuit area is 13.12% of a 6λ/4-ring. All the designs are validated by comparing measured four-port parameters with the simulated results.
UR - http://www.scopus.com/inward/record.url?scp=64049085057&partnerID=8YFLogxK
U2 - 10.1109/IMWS.2008.4782251
DO - 10.1109/IMWS.2008.4782251
M3 - 会议稿件
AN - SCOPUS:64049085057
SN - 9781424428779
T3 - 2008 IEEE MTT-S International Microwave Workshop Series IMWS on Art of Miniaturizing RF and Microwave Passive Components - Proceeding
SP - 19
EP - 22
BT - 2008 IEEE MTT-S International Microwave Workshop Series IMWS on Art of Miniaturizing RF and Microwave Passive Components - Proceeding
T2 - 2008 IEEE MTT-S International Microwave Workshop Series IMWS on Art of Miniaturizing RF and Microwave Passive Components
Y2 - 14 December 2008 through 15 December 2008
ER -