Mobility-enhancement technologies

Chee Wee Liu; S. Maikap; C. Y. Yu

doi:10.1109/MCD.2005.1438752

Mobility-enhancement technologies

Chee Wee Liu^*, S. Maikap, C. Y. Yu

^*Corresponding author for this work

National Taiwan University

Research output: Contribution to journal › Review article › peer-review

105 Scopus citations

Abstract

To be practical for VLSI applications, mobility-enhancement technology has to be low cost and high performance. The new material and new substrate orientation approaches offer mobility enhancement, but process complexities can lead to high cost. However, exploiting processes available in current VLSI fabrication to produce desired strain can be cost-effective with reasonable enhancement. Package-strain is modular technology, which is applied after the ICs fabrication without the introduction of new process, and the enhancement is satisfactory for most applications. The combination of new material, process induced strain, and package strain continues to improve future performance.

Original language	English
Pages (from-to)	21-36
Number of pages	16
Journal	IEEE Circuits and Devices Magazine
Volume	21
Issue number	3
DOIs	https://doi.org/10.1109/MCD.2005.1438752
State	Published - 05 2005
Externally published	Yes

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title = "Mobility-enhancement technologies",

abstract = "To be practical for VLSI applications, mobility-enhancement technology has to be low cost and high performance. The new material and new substrate orientation approaches offer mobility enhancement, but process complexities can lead to high cost. However, exploiting processes available in current VLSI fabrication to produce desired strain can be cost-effective with reasonable enhancement. Package-strain is modular technology, which is applied after the ICs fabrication without the introduction of new process, and the enhancement is satisfactory for most applications. The combination of new material, process induced strain, and package strain continues to improve future performance.",

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AB - To be practical for VLSI applications, mobility-enhancement technology has to be low cost and high performance. The new material and new substrate orientation approaches offer mobility enhancement, but process complexities can lead to high cost. However, exploiting processes available in current VLSI fabrication to produce desired strain can be cost-effective with reasonable enhancement. Package-strain is modular technology, which is applied after the ICs fabrication without the introduction of new process, and the enhancement is satisfactory for most applications. The combination of new material, process induced strain, and package strain continues to improve future performance.

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Mobility-enhancement technologies

Abstract

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