Modeling and simulation of thermally induced stress and warpage in injection molded thermoplastics

Shih Jung Liu*, J. X. Rietveld

*Corresponding author for this work

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

During the injection molding process, the effect of the processing conditions, the material behavior as well as the geometric effects should be accounted in order to predict the residual stress and warpage in a polymer product. Up to date, several numerical models have been proposed to simulate the formation of thermally induced residual stresses. In this paper, an approach is proposed to examine the thermally induced stress and warpage problem using a novel material description and a more comprehensive geometric description with the intent of either reaching or understanding more inclusive/realistic problems.

Original languageEnglish
Pages684-701
Number of pages18
StatePublished - 1995
EventProceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA
Duration: 07 05 199511 10 1995

Conference

ConferenceProceedings of the 53rd Annual Technical Conference. Part 1 (of 3)
CityBoston, MA, USA
Period07/05/9511/10/95

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