Modeling cell nucleation during microcellular injection molding

Juan P. Hernandez; Alexander Chandra; Andreas Winardi; Lih Sheng Turng; Tim Osswald; Paul Gramann

Modeling cell nucleation during microcellular injection molding

Juan P. Hernandez
, Alexander Chandra
, Andreas Winardi
, Lih Sheng Turng
, Tim Osswald^*
, Paul Gramann

^*Corresponding author for this work

University of Wisconsin-Madison
Madison Group

Research output: Contribution to conference › Conference Paper › peer-review

9 Scopus citations

Abstract

This paper presents a numerical simulation to predict nucleation and cell growth through the injection molding process. The model presented is based on a coupled solidification-nucleation process that considers mold and melt temperature, injection pressure, and material properties. Comparison of numerical prediction to experimental results was excellent at the center of the part, but under-predicted the cell size toward its outer surface. From numerical simulation, the influence of varying processing conditions on the cell structure is quantified.

Original language	English
Pages	2210-2214
Number of pages	5
State	Published - 2003
Externally published	Yes
Event	61st Annual Technical Conference ANTEC 2003 - Nashville, TN, United States Duration: 04 05 2003 → 08 05 2003

Conference

Conference	61st Annual Technical Conference ANTEC 2003
Country/Territory	United States
City	Nashville, TN
Period	04/05/03 → 08/05/03

Cite this

@conference{d2d588b231e1451db7ab6f5939bbf181,

title = "Modeling cell nucleation during microcellular injection molding",

abstract = "This paper presents a numerical simulation to predict nucleation and cell growth through the injection molding process. The model presented is based on a coupled solidification-nucleation process that considers mold and melt temperature, injection pressure, and material properties. Comparison of numerical prediction to experimental results was excellent at the center of the part, but under-predicted the cell size toward its outer surface. From numerical simulation, the influence of varying processing conditions on the cell structure is quantified.",

author = "Hernandez, \{Juan P.\} and Alexander Chandra and Andreas Winardi and Turng, \{Lih Sheng\} and Tim Osswald and Paul Gramann",

year = "2003",

language = "英语",

pages = "2210--2214",

note = "61st Annual Technical Conference ANTEC 2003 ; Conference date: 04-05-2003 Through 08-05-2003",

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TY - CONF

T1 - Modeling cell nucleation during microcellular injection molding

AU - Hernandez, Juan P.

AU - Chandra, Alexander

AU - Winardi, Andreas

AU - Turng, Lih Sheng

AU - Osswald, Tim

AU - Gramann, Paul

PY - 2003

Y1 - 2003

N2 - This paper presents a numerical simulation to predict nucleation and cell growth through the injection molding process. The model presented is based on a coupled solidification-nucleation process that considers mold and melt temperature, injection pressure, and material properties. Comparison of numerical prediction to experimental results was excellent at the center of the part, but under-predicted the cell size toward its outer surface. From numerical simulation, the influence of varying processing conditions on the cell structure is quantified.

AB - This paper presents a numerical simulation to predict nucleation and cell growth through the injection molding process. The model presented is based on a coupled solidification-nucleation process that considers mold and melt temperature, injection pressure, and material properties. Comparison of numerical prediction to experimental results was excellent at the center of the part, but under-predicted the cell size toward its outer surface. From numerical simulation, the influence of varying processing conditions on the cell structure is quantified.

UR - https://www.scopus.com/pages/publications/0141616447

M3 - 论文

AN - SCOPUS:0141616447

SP - 2210

EP - 2214

T2 - 61st Annual Technical Conference ANTEC 2003

Y2 - 4 May 2003 through 8 May 2003

ER -

Modeling cell nucleation during microcellular injection molding

Abstract

Conference

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