Modeling requirements for computer-aided VLSI circuit reliability assessment

Bing J. Sheu*, Wen Jay Hsu, Vance C. Tyree

*Corresponding author for this work

Research output: Contribution to conferenceConference Paperpeer-review

1 Scopus citations

Abstract

It is noted that challenges to the improvement of quality and reliability in VLSI circuits come from the rapid advances of CMOS fabrication technologies. To provide circuit designers with the means for designing circuits that can utilize the full reliability potential of the fabrication technology, a circuit reliability simulator has been developed. Key reliability concerns in VLSI circuits and microsystems include hot-carrier damage, electromigration, time-dependent dielectric breakdown, packaging damage, radiation damage, and contamination of oxides and junctions. The authors describe several salient modeling requirements for reliability simulations at the detailed circuit-design level using the SPICE circuit simulator as the key module.

Original languageEnglish
Pages199-204
Number of pages6
StatePublished - 1989
Externally publishedYes
EventProceedings of the Eighth Biennial University/Government/Industry Microelectronics Symposium - Westborough, MA, USA
Duration: 12 06 198914 06 1989

Conference

ConferenceProceedings of the Eighth Biennial University/Government/Industry Microelectronics Symposium
CityWestborough, MA, USA
Period12/06/8914/06/89

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