Modulation of the electrical characteristics of HfOx/TiN RRAM devices through the top electrode metal

K. M. Chang, W. H. Tzeng, K. C. Liu, W. R. Lai

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

The effect of the top electrode on switching characteristics of a HfOx/TiN structure was investigated. From the electrical conduction analysis, the conduction mechanism between Pt and Ti was found to be quite different. A potential barrier formed in the Pt/HfOx interface showing the Fowler-Nordheim tunneling at high bias. However, it was not observed in the Ti/HfOx structure. Reactive metal Ti interacted with the underlying HfOx film leading to destruction of the barrier height. As such, the device lost the ability to operate at the μA compliance current range. Pt/HfOx demonstrated the merit of a large resistance ratio and a low operation current (Ireset = 20 μA). However, Ti/HfOx exhibited better voltage dispersion at the low resistance state (0.5V dispersion). The electrode plays a dominant role in determining the electrical characteristics of a resistive random access memory (RRAM) device. Therefore, choosing an adequate electrode for RRAM is an important consideration.

Original languageEnglish
Title of host publicationDielectrics for Nanosystems 4
Subtitle of host publicationMaterials Science, Processing, Reliability, and Manufacturing
PublisherElectrochemical Society Inc.
Pages119-126
Number of pages8
Edition2
ISBN (Electronic)9781607681427
ISBN (Print)9781566777926
DOIs
StatePublished - 2010

Publication series

NameECS Transactions
Number2
Volume28
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

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