Moisture resistance evaluation on single electronic package moulding compound

Cher Ming Tan; Udit Narula; Guan Ling Seow; Vivek Sangwan; Ching Hsiang Chen; Shu Ping Lin; Jia Yuan Chen

doi:10.1039/c9tc04298a

Moisture resistance evaluation on single electronic package moulding compound

Cher Ming Tan^*, Udit Narula, Guan Ling Seow, Vivek Sangwan, Ching Hsiang Chen, Shu Ping Lin, Jia Yuan Chen

^*Corresponding author for this work

Department of Electronic Engineering

Research output: Contribution to journal › Journal Article › peer-review

4 Scopus citations

Abstract

Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed. These indices are developed from detailed studies on the functional groups in a moulding compound, and their effectiveness is verified experimentally. With these indices, one can ensure the moisture resistance of an individual package without the need of the standard humidity tests which require long test durations on limited number of samples where extrapolation with statistical uncertainty will be present.

Original language	English
Pages (from-to)	1943-1952
Number of pages	10
Journal	Journal of Materials Chemistry C
Volume	8
Issue number	6
DOIs	https://doi.org/10.1039/c9tc04298a
State	Published - 14 02 2020

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© 2020 The Royal Society of Chemistry.

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abstract = "Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed. These indices are developed from detailed studies on the functional groups in a moulding compound, and their effectiveness is verified experimentally. With these indices, one can ensure the moisture resistance of an individual package without the need of the standard humidity tests which require long test durations on limited number of samples where extrapolation with statistical uncertainty will be present.",

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AU - Seow, Guan Ling

AU - Sangwan, Vivek

AU - Chen, Ching Hsiang

AU - Lin, Shu Ping

AU - Chen, Jia Yuan

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N2 - Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed. These indices are developed from detailed studies on the functional groups in a moulding compound, and their effectiveness is verified experimentally. With these indices, one can ensure the moisture resistance of an individual package without the need of the standard humidity tests which require long test durations on limited number of samples where extrapolation with statistical uncertainty will be present.

AB - Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed. These indices are developed from detailed studies on the functional groups in a moulding compound, and their effectiveness is verified experimentally. With these indices, one can ensure the moisture resistance of an individual package without the need of the standard humidity tests which require long test durations on limited number of samples where extrapolation with statistical uncertainty will be present.

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M3 - 文章

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Moisture resistance evaluation on single electronic package moulding compound

Abstract

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