Novel cleaning solutions for polysilicon film post chemical mechanical polishing

Tung Ming Pan; Tan Fu Lei; Chao Chyi Chen; Tien Sheng Chao; Ming Chi Liaw; Wen Lu Yang; Ming Shih Tsai; C. P. Lu; W. H. Chang

doi:10.1109/55.847373

Novel cleaning solutions for polysilicon film post chemical mechanical polishing

Tung Ming Pan, Tan Fu Lei, Chao Chyi Chen, Tien Sheng Chao, Ming Chi Liaw, Wen Lu Yang, Ming Shih Tsai, C. P. Lu, W. H. Chang

Research output: Contribution to journal › Journal Article › peer-review

28 Scopus citations

Abstract

Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH₄OH+H₂O) alkaline aqueous solution to enhance removal of metallic and organic contamination. From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning.

Original language	English
Pages (from-to)	338-340
Number of pages	3
Journal	IEEE Electron Device Letters
Volume	21
Issue number	7
DOIs	https://doi.org/10.1109/55.847373
State	Published - 07 2000
Externally published	Yes

Access to Document

10.1109/55.847373

Cite this

@article{d171d8808ba64bc8b75d379ec16c374d,

title = "Novel cleaning solutions for polysilicon film post chemical mechanical polishing",

abstract = "Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH4OH+H2O) alkaline aqueous solution to enhance removal of metallic and organic contamination. From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning.",

author = "Pan, {Tung Ming} and Lei, {Tan Fu} and Chen, {Chao Chyi} and Chao, {Tien Sheng} and Liaw, {Ming Chi} and Yang, {Wen Lu} and Tsai, {Ming Shih} and Lu, {C. P.} and Chang, {W. H.}",

year = "2000",

month = jul,

doi = "10.1109/55.847373",

language = "英语",

volume = "21",

pages = "338--340",

journal = "IEEE Electron Device Letters",

issn = "0741-3106",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "7",

}

TY - JOUR

T1 - Novel cleaning solutions for polysilicon film post chemical mechanical polishing

AU - Pan, Tung Ming

AU - Lei, Tan Fu

AU - Chen, Chao Chyi

AU - Chao, Tien Sheng

AU - Liaw, Ming Chi

AU - Yang, Wen Lu

AU - Tsai, Ming Shih

AU - Lu, C. P.

AU - Chang, W. H.

PY - 2000/7

Y1 - 2000/7

N2 - Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH4OH+H2O) alkaline aqueous solution to enhance removal of metallic and organic contamination. From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning.

AB - Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH4OH+H2O) alkaline aqueous solution to enhance removal of metallic and organic contamination. From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning.

UR - http://www.scopus.com/inward/record.url?scp=0034217259&partnerID=8YFLogxK

U2 - 10.1109/55.847373

DO - 10.1109/55.847373

M3 - 文章

AN - SCOPUS:0034217259

SN - 0741-3106

VL - 21

SP - 338

EP - 340

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

IS - 7

ER -

Novel cleaning solutions for polysilicon film post chemical mechanical polishing

Abstract

Access to Document

Other files and links

Fingerprint

Cite this