Novel test structure for evaluating dynamic dopant activation after ion implantation

Jung Ruey Tsai, Ruey Dar Chang, Cheng Hui Chou, Hsueh Chun Liao, Sz Kai Huang, Sung Hung Lin, Jui Chang Lin

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This work focuses on the development of a novel test structure to evaluate the dynamic behavior of electrical characteristics in the boron-implanted germanium samples during the solid phase epitaxial regrowth (SPER) at low temperature annealing of 360 and 400 °C with various annealing times ranging from 30 to 300 min. In the early stage of SPER annealing, the sheet carrier concentration is increased with annealing time. And then, it will saturate to a level after about 2 hr annealing which implies the completion of SPER process.

Original languageEnglish
Title of host publication2016 29th IEEE International Conference on Microelectronic Test Structures, ICMTS 2016 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages168-171
Number of pages4
ISBN (Electronic)9781467387934
DOIs
StatePublished - 20 05 2016
Event29th IEEE International Conference on Microelectronic Test Structures, ICMTS 2016 - Yokohama, Japan
Duration: 28 03 201631 03 2016

Publication series

NameIEEE International Conference on Microelectronic Test Structures
Volume2016-May

Conference

Conference29th IEEE International Conference on Microelectronic Test Structures, ICMTS 2016
Country/TerritoryJapan
CityYokohama
Period28/03/1631/03/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Keywords

  • Hall measurement
  • SPER
  • dopant activation
  • germanium

Fingerprint

Dive into the research topics of 'Novel test structure for evaluating dynamic dopant activation after ion implantation'. Together they form a unique fingerprint.

Cite this