Optimal parameter design of solder residue in flip chip process by using Taguchi method

Jian Long Kuo*, Kai Lun Chao, Chun Cheng Kuo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Because the solder residue was found in the manufacturing process which greatly affected the product quality, the purpose of this paper was to make the product quality improved and to find an optimal solution for process parameters in the flip chip process. The experimental testing was based on SMT manufacturing process. The amount and size of solder left on passive component in the process of manufacturing were considered as the quality traits. Since too many solders left on the passive component side during flux cleaning process, it was possible that the balling would be flowed into the chip, which caused the bump short in the chip and affected the quality of the product. In this paper, orthogonal array by using Taguchi method is adopted as the effective experimental method with the least experimental runs. Also, based on the quality evaluation of signal-to-noise ratio, the ANOVA is used to evaluate the effects of quality target according to the experimental results. The results reveal that the optimization in the process is confirmed. Therefore, this study can effectively improve the solder residue in semiconductor manufacturing process.

Original languageEnglish
Title of host publicationAdvances in Materials Processing IX
PublisherTrans Tech Publications Ltd
Pages543-548
Number of pages6
ISBN (Print)0878492674, 9780878492671
DOIs
StatePublished - 2010
Externally publishedYes
Event9th Asia-Pacific Conference on Materials Processing, APCMP2010 - Sydney, NSW, Australia
Duration: 07 06 201010 06 2010

Publication series

NameKey Engineering Materials
Volume443
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

Conference9th Asia-Pacific Conference on Materials Processing, APCMP2010
Country/TerritoryAustralia
CitySydney, NSW
Period07/06/1010/06/10

Keywords

  • Solder bead
  • Solder residue
  • Taguchi method

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