Optimization of the au stud bump number for the flip-chip packaged InGaN LEDs

Yun Yun Zhang, Xiao Wei Sun, Wen Yu Kuo, Liann Be Chang, Bohr Ran Huang, Jun Liang Zhao, Hai Tao Dai, Shu Guo Wang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Au stud bump can provide a good heat spreading path for the flip-chip LED due to its high thermal conductivity (300 W/mK) In this paper, we compared four flip-chip LED devices with four different numbers of Au stud bumps. The thermal imaging analysis indicates that the heat dissipation is proportional to the number of Au stud bump. However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate. Therefore, the number of Au stud bumps was optimized to be 20 to 24, which can be employed to develop flip-chip LEDs with optimum electrical and optical performance.

Original languageEnglish
Title of host publicationMaterials Processing and Manufacturing III
Pages2515-2520
Number of pages6
DOIs
StatePublished - 2013
Event3rd International Conference on Advanced Engineering Materials and Technology, AEMT 2013 - Zhangjiajie, China
Duration: 11 05 201312 05 2013

Publication series

NameAdvanced Materials Research
Volume753-755
ISSN (Print)1022-6680

Conference

Conference3rd International Conference on Advanced Engineering Materials and Technology, AEMT 2013
Country/TerritoryChina
CityZhangjiajie
Period11/05/1312/05/13

Keywords

  • Au stud bumps
  • Flip-chip LED
  • Thermal analysis
  • Thermosonic bonding

Fingerprint

Dive into the research topics of 'Optimization of the au stud bump number for the flip-chip packaged InGaN LEDs'. Together they form a unique fingerprint.

Cite this