Abstract
Titanium-doped erbium oxide films on Si(100) have been investigated as an alternative gate dielectric. The dielectric films were characterized by X-ray photoelectron spectroscopy, atomic force microscopy, and electrical measurements. We found that the addition of Ti into Er2 O3 film after annealing at 700°C can reduce the SiOx formation at the interfacial layer and thus reduce the O diffusion during the film postthermal annealing process. Such suppression effect significantly improved the electrical properties of the dielectric films.
| Original language | English |
|---|---|
| Pages (from-to) | G54-G57 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 10 |
| Issue number | 8 |
| DOIs | |
| State | Published - 2007 |
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