@inproceedings{f254ee14167f46f58c5ced863da6fbff,
title = "Preliminary study of 60 GHz air-filled SIW H-plane horn antenna",
abstract = "In this paper, an H-plane substrate integrated waveguide (SIW) 60 GHz horn antenna is designed and studied using flip-chip technology. The SIW horn input reflection coefficient and output radiation at 60 GHz have been simulated for an air-filled, bump-supported substrate of 100 μm thick. Radiation gain has been observed. Coplanar waveguide to microstrip and microstrip line to SIW transitions are also designed for possibly realization of the antenna.",
keywords = "H-plane horn antenna, millimeter wave, on-chip antenna, substrate integrated waveguide (SIW)",
author = "Fu, {Jeffrey S.}",
year = "2011",
doi = "10.1109/EDAPS.2011.6213765",
language = "英语",
isbn = "9781467322881",
series = "2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011",
booktitle = "2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011",
note = "2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 ; Conference date: 12-12-2011 Through 14-12-2011",
}