Preliminary study of 60 GHz air-filled SIW H-plane horn antenna

Jeffrey S. Fu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In this paper, an H-plane substrate integrated waveguide (SIW) 60 GHz horn antenna is designed and studied using flip-chip technology. The SIW horn input reflection coefficient and output radiation at 60 GHz have been simulated for an air-filled, bump-supported substrate of 100 μm thick. Radiation gain has been observed. Coplanar waveguide to microstrip and microstrip line to SIW transitions are also designed for possibly realization of the antenna.

Original languageEnglish
Title of host publication2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs
StatePublished - 2011
Event2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China
Duration: 12 12 201114 12 2011

Publication series

Name2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011

Conference

Conference2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
Country/TerritoryChina
CityHanzhou
Period12/12/1114/12/11

Keywords

  • H-plane horn antenna
  • millimeter wave
  • on-chip antenna
  • substrate integrated waveguide (SIW)

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