QFN封裝組合體受溫度循環之可靠度分析

Translated title of the contribution: Thermal Cycling Life of QFN Package Assembly

韓政男

Research output: Types of Thesis › Master's thesis

Translated title of the contributionThermal Cycling Life of QFN Package Assembly
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 2003
Externally publishedYes

Access to Document

Cite this