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Reliability and Failure Analysis of High-Power LED Packaging
Cher Ming Tan
, Preetpal Singh
Department of Electronic Engineering
Epistar Corporation Taiwan
Research output
:
Book/Report
›
Book
›
peer-review
1
Scopus citations
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Dive into the research topics of 'Reliability and Failure Analysis of High-Power LED Packaging'. Together they form a unique fingerprint.
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Physics
Reliability
100%
Failure
100%
Failure Analysis
100%
Standard
40%
Simulation
40%
Utilization
20%
Microscopy
20%
Scanning Electron Microscopy
20%
Material Science
Packaging Material
100%
Scanning Electron Microscopy
50%
Microscopy
50%
Failure Analysis of Materials
50%