Reliability assurance of application-specific microelectronic circuits

Bing J. Sheu*, Wen Jay Hsu, Vance Tyree

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

An integrated-circuit reliability simulator has been developed. Model parameters for the reliability simulation are obtained through accelerated tests on specially designed test structures. The design of several test chips and associated experimental results are presented. Reliability simulations are described at the detailed circuit-design level using the SPICE circuit simulator or its derivatives as the key module. A computer-automated characterization system is necessary to extract parameter values for the new degradation models.

Original languageEnglish
Pages (from-to)381-388
Number of pages8
JournalProceedings of the Annual Reliability and Maintainability Symposium
StatePublished - 1990
Externally publishedYes
Event1990 Proceedings - Annual Reliability and Maintainability Symposium - Los Angeles, CA, USA
Duration: 23 01 199025 01 1990

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