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Reliability improvement in Al metallization: A combination of statistical prediction and failure analytical methodology

  • G. Zhang*
  • , C. M. Tan
  • , K. T. Tan
  • , K. Y. Sim
  • , W. Y. Zhang
  • *Corresponding author for this work
  • Nanyang Technological University
  • Syst. on Silicon Mfg. Co. Pte. Ltd.

Research output: Contribution to journalJournal Article peer-review

5 Scopus citations

Abstract

Failure mechanism identification in metal interconnect is an important step to appropriately improve the interconnect reliability characteristics. However, analysis of all the failed units from accelerated testing is too time consuming and impractical in industry. In this work, a statistical prediction combined with advanced failure analytical techniques is developed that can classify all the failed units into different failure categories simply based on their time to failure. Thereafter, detail failure analysis on only one or two failures within each category will be sufficient to identify the failure mechanisms of different categories. An industrial case is given to illustrate this analysis procedure. This approach also suggests that the early failure could be different under stress and normal use condition, and hence, care have to be taken when prioritize improvement action for field reliability improvement.

Original languageEnglish
Pages (from-to)1843-1848
Number of pages6
JournalMicroelectronics Reliability
Volume44
Issue number9-11 SPEC. ISS.
DOIs
StatePublished - 09 2004
Externally publishedYes

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