Reliability Ranking of Nodes: A Case of Revolution

Priya Ranjan, Harshit Pandey, Malay Ranjan Tripathy, Cher Ming Tan, Saumay Pushp

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Analysis from perspectives of modeling networks via the adjacency connections has been explored in multiple studies. In the physical real time domain however, the entries of adjacency do not just limit to values of zeros and ones but are far more complicated than simple binary digits depending on the strength and reliability of connections between nodes in different network scenarios. This strength and reliability of connections represents the quality indicator of edges that are a quantitative indication of successful transmission of data via links. This work approaches to model networks as representations that consider building up of connectivity matrix with reliability indices between one and zero and studies their impact on ranking of nodes. Lessons we learn in this work is it's not just connectivity and degrees of node to lead the rankings rather reliability of links is a key player which can make or break the node's rank leadership. We argue that there is a fresh need to put reliability in perspective for exploring ranking of nodes in large network settings.

Original languageEnglish
Title of host publication2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1542-1549
Number of pages8
ISBN (Electronic)9784885523151
DOIs
StatePublished - 31 12 2018
Event2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Toyama, Japan
Duration: 01 08 201804 08 2018

Publication series

NameProgress in Electromagnetics Research Symposium
Volume2018-August
ISSN (Print)1559-9450
ISSN (Electronic)1931-7360

Conference

Conference2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018
Country/TerritoryJapan
CityToyama
Period01/08/1804/08/18

Bibliographical note

Publisher Copyright:
© 2018 The Institute of Electronics, Information and Communication Engineers (IEICE).

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