@inproceedings{29e6ec57bdc9451c85643d3190261715,
title = "Requirement for accurate interconnect temperature measurement for electromigration test",
abstract = "In this work, we show accurate temperature measurement is important in electromigration (EM) test as it can affect the measured activation energy EA and current density exponent n. The deviation of measured EA and n due to the interconnect temperature variations are derived analytically and illustrated in Cu/low-k interconnects using finite element analysis (FEA) under typical experimental conditions. The derived formulations are verified by our previous experimental works.",
keywords = "Activation energy, Current density exponent, Electromigration",
author = "Yuejin Hou and Tan, {Cher Ming}",
year = "2009",
language = "英语",
isbn = "9789810824686",
series = "ISIC-2009 - 12th International Symposium on Integrated Circuits, Proceedings",
pages = "522--525",
booktitle = "ISIC-2009 - 12th International Symposium on Integrated Circuits, Proceedings",
note = "12th International Symposium on Integrated Circuits, ISIC-2009 ; Conference date: 14-12-2009 Through 16-12-2009",
}