Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test

Cher Ming Tan; Udit Narula

doi:10.1109/ICSICT.2014.7021168

Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test

Cher Ming Tan^*
, Udit Narula

^*Corresponding author for this work

Department of Electronic Engineering

Chang Gung University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

TSV and micro-Solder bump are key interconnects for 2.5D and 3D Integrated circuit (IC) chips, and being part of interconnects for IC, their Electromigration reliability must be assessed. However, their resistances are much smaller than that of interconnect lines in IC, and this renders difficulty in having accurate resistance monitoring of TSV and micro-solder bump during their Electromigration tests. In this work, we demonstrated the inappropriateness and inadequacies of the conventional resistance monitoring methods and their manifold improvement in measurement accuracy by mere changing the design of the test structure. The new structure can also reduce the impact of the interconnect lines that lead to the TSV and/or micro-Solder bump on their resistance measurement accuracy.

Original language	English
Title of host publication	Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014
Editors	Jia Zhou, Ting-Ao Tang
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479932962
DOIs	https://doi.org/10.1109/ICSICT.2014.7021168
State	Published - 23 01 2014
Event	2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 - Guilin, China Duration: 28 10 2014 → 31 10 2014

Publication series

Name	Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014

Conference

Conference	2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014
Country/Territory	China
City	Guilin
Period	28/10/14 → 31/10/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

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10.1109/ICSICT.2014.7021168

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Tan, C. M., & Narula, U. (2014). Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test. In J. Zhou, & T.-A. Tang (Eds.), Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 Article 7021168 (Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSICT.2014.7021168

Tan, Cher Ming ; Narula, Udit. / Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test. Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014. editor / Jia Zhou ; Ting-Ao Tang. Institute of Electrical and Electronics Engineers Inc., 2014. (Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014).

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title = "Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test",

abstract = "TSV and micro-Solder bump are key interconnects for 2.5D and 3D Integrated circuit (IC) chips, and being part of interconnects for IC, their Electromigration reliability must be assessed. However, their resistances are much smaller than that of interconnect lines in IC, and this renders difficulty in having accurate resistance monitoring of TSV and micro-solder bump during their Electromigration tests. In this work, we demonstrated the inappropriateness and inadequacies of the conventional resistance monitoring methods and their manifold improvement in measurement accuracy by mere changing the design of the test structure. The new structure can also reduce the impact of the interconnect lines that lead to the TSV and/or micro-Solder bump on their resistance measurement accuracy.",

author = "Tan, \{Cher Ming\} and Udit Narula",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 ; Conference date: 28-10-2014 Through 31-10-2014",

year = "2014",

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language = "英语",

series = "Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014",

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editor = "Jia Zhou and Ting-Ao Tang",

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Tan, CM & Narula, U 2014, Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test. in J Zhou & T-A Tang (eds), Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014., 7021168, Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014, Institute of Electrical and Electronics Engineers Inc., 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014, Guilin, China, 28/10/14. https://doi.org/10.1109/ICSICT.2014.7021168

Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test. / Tan, Cher Ming; Narula, Udit.
Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014. ed. / Jia Zhou; Ting-Ao Tang. Institute of Electrical and Electronics Engineers Inc., 2014. 7021168 (Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test

AU - Tan, Cher Ming

AU - Narula, Udit

PY - 2014/1/23

Y1 - 2014/1/23

N2 - TSV and micro-Solder bump are key interconnects for 2.5D and 3D Integrated circuit (IC) chips, and being part of interconnects for IC, their Electromigration reliability must be assessed. However, their resistances are much smaller than that of interconnect lines in IC, and this renders difficulty in having accurate resistance monitoring of TSV and micro-solder bump during their Electromigration tests. In this work, we demonstrated the inappropriateness and inadequacies of the conventional resistance monitoring methods and their manifold improvement in measurement accuracy by mere changing the design of the test structure. The new structure can also reduce the impact of the interconnect lines that lead to the TSV and/or micro-Solder bump on their resistance measurement accuracy.

AB - TSV and micro-Solder bump are key interconnects for 2.5D and 3D Integrated circuit (IC) chips, and being part of interconnects for IC, their Electromigration reliability must be assessed. However, their resistances are much smaller than that of interconnect lines in IC, and this renders difficulty in having accurate resistance monitoring of TSV and micro-solder bump during their Electromigration tests. In this work, we demonstrated the inappropriateness and inadequacies of the conventional resistance monitoring methods and their manifold improvement in measurement accuracy by mere changing the design of the test structure. The new structure can also reduce the impact of the interconnect lines that lead to the TSV and/or micro-Solder bump on their resistance measurement accuracy.

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DO - 10.1109/ICSICT.2014.7021168

M3 - 会议稿件

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T3 - Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014

BT - Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014

A2 - Zhou, Jia

A2 - Tang, Ting-Ao

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014

Y2 - 28 October 2014 through 31 October 2014

ER -

Tan CM, Narula U. Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test. In Zhou J, Tang TA, editors, Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 7021168. (Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014). doi: 10.1109/ICSICT.2014.7021168

Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test

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