Abstract
A high power-Added efficiency and low dynamic on-resistance (RON) AlGaN/GaN metal-insulator-semiconductorhigh-electronmobility transistor (MISHEMT) with in situ SiNx insulator design was demonstrated on 150-mm silicon-on-insulator (SOI) substrate. Compared to traditional high-resistivity Si substrate, SiNx/AlGaN/GaN MISHEMT grown on the SOI 5-μm-Thick Si active layer performed better tensile stress relaxation and surface flatness. Based on Hall measurement results, electron mobility and the sheet charge density on SOI substrate were improved simultaneouslyowing to a lower-defectdensitywhichis also proofed by pulse measurement and low-frequency noise measurement. Due to the low-feedback substrate capacitance, the bandwidth, and the linearity were also improved simultaneously by SOI substrate design.
Original language | English |
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Article number | 8023774 |
Pages (from-to) | 4065-4070 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 64 |
Issue number | 10 |
DOIs | |
State | Published - 10 2017 |
Bibliographical note
Publisher Copyright:© 1963-2012 IEEE.
Keywords
- GaN
- in situ SiN
- metal-insulator-semiconductor high-electron mobility transistor (MISHEMT)
- pulse measurement
- silicon-on-insulator (SOI).