RFICs on polydimethylsiloxane for flexible electronics applications

T. Wang*, H. C. Chen, P. L. Huang, Y. Y. Chiang, S. S. Lu

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

3 Scopus citations

Abstract

RFICs were thinned down and transferred to the flexible substrate by the proposed polydimethylsiloxane-substrate transfer technology (PSTT). Measurement results show the feasibility of the proposed technique, and furthermore prove its ability to reduce the substrate loss in the high frequency range. With PSTT, the quality factor of a 3.5 turns inductor is improved from 9.3 to 13.4 and the noise figure of a 5-6GHz direct-conversion receiver is reduced by 0.5dB. The demonstration reveals the potential of PSTT for the flexible electronics in RFICs applications.

Original languageEnglish
Pages (from-to)1276-1277
Number of pages2
JournalElectronics Letters
Volume43
Issue number23
DOIs
StatePublished - 2007
Externally publishedYes

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