RGB-stack light emitting diode modules with transparent glass circuit board and oil encapsulation

Ying Chang Li, Yuan Hsiao Chang, Preetpal Singh, Liann Be Chang*, Der Hwa Yeh, Ting Yu Chao, Si Yun Jian, Yu Chi Li, Cher Ming Tan, Chao Sung Lai, Lee Chow, Shang Ping Ying

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

2 Scopus citations


The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.

Original languageEnglish
Article number365
Issue number3
StatePublished - 01 03 2018

Bibliographical note

Publisher Copyright:
© 2018 by the authors.


  • Cooling oil encapsulation
  • Stacking module
  • Transparent glass circuit board


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