Si - H bond breaking induced retention degradation during packaging process of 256 Mbit DRAMs with negative wordline bias

  • Minchen Chang*
  • , Jengping Lin
  • , Chao Sung Lai
  • , Ruey Dar Chang
  • , Steven N. Shih
  • , Mao Ying Wang
  • , Pei Ing Lee
    • *Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

23 Scopus citations

Fingerprint

Dive into the research topics of 'Si - H bond breaking induced retention degradation during packaging process of 256 Mbit DRAMs with negative wordline bias'. Together they form a unique fingerprint.

Engineering

Computer Science