Simulation and optimization of MCM interconnections

W. S. Feng; S. Tenqchen; M. C. Cheng

doi:10.1109/ICMCM.1998.670776

Simulation and optimization of MCM interconnections

W. S. Feng, S. Tenqchen, M. C. Cheng

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.

Original language	English
Title of host publication	Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	178-183
Number of pages	6
ISBN (Electronic)	0780348508, 9780780348509
DOIs	https://doi.org/10.1109/ICMCM.1998.670776
State	Published - 1998
Externally published	Yes
Event	7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 - Denver, United States Duration: 17 04 1998 → …

Publication series

Name	Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging
Volume	1998-April

Conference

Conference	7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998
Country/Territory	United States
City	Denver
Period	17/04/98 → …

Bibliographical note

Publisher Copyright:
© 1998 IEEE.

Access to Document

10.1109/ICMCM.1998.670776

Cite this

Feng, W. S., Tenqchen, S., & Cheng, M. C. (1998). Simulation and optimization of MCM interconnections. In Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging (pp. 178-183). (Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging; Vol. 1998-April). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMCM.1998.670776

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title = "Simulation and optimization of MCM interconnections",

abstract = "In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.",

author = "Feng, {W. S.} and S. Tenqchen and Cheng, {M. C.}",

note = "Publisher Copyright: {\textcopyright} 1998 IEEE.; 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 ; Conference date: 17-04-1998",

year = "1998",

doi = "10.1109/ICMCM.1998.670776",

language = "英语",

series = "Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "178--183",

booktitle = "Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging",

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}

Feng, WS, Tenqchen, S & Cheng, MC 1998, Simulation and optimization of MCM interconnections. in Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging, vol. 1998-April, Institute of Electrical and Electronics Engineers Inc., pp. 178-183, 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998, Denver, United States, 17/04/98. https://doi.org/10.1109/ICMCM.1998.670776

Simulation and optimization of MCM interconnections. / Feng, W. S.; Tenqchen, S.; Cheng, M. C.
Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Institute of Electrical and Electronics Engineers Inc., 1998. p. 178-183 (Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging; Vol. 1998-April).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.

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Feng WS, Tenqchen S, Cheng MC. Simulation and optimization of MCM interconnections. In Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Institute of Electrical and Electronics Engineers Inc. 1998. p. 178-183. (Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging). doi: 10.1109/ICMCM.1998.670776

Simulation and optimization of MCM interconnections

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