@inproceedings{8f94ae7c02ed4009b252c30fef5387d9,
title = "Size effect in Cu nano-interconnects and its implication on electromigration",
abstract = "With the interconnect dimensions approaching the length of the mean free path (MFP) of the electron, size effects are becoming important. This is manifested in the increase of the resistivity for nano-interconnects. This change in the electrical properties will pose new challenges in the EM performance for Cu nano-interconnects.",
keywords = "Electromigration, Nano-interconnect, Size effect",
author = "Yuejin Hou and Tan, {Cher Ming}",
year = "2008",
doi = "10.1109/INEC.2008.4585561",
language = "英语",
isbn = "9781424415731",
series = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008",
pages = "610--613",
booktitle = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008",
note = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 ; Conference date: 24-03-2008 Through 27-03-2008",
}