Soft breakdown of hafnium oxynitride gate dielectrics

Jer Chyi Wang*, De Ching Shie, Tan Fu Lei, Chung Len Lee

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

5 Scopus citations

Abstract

A detailed study of soft breakdown modes for hafnium oxynitride (HfON) gate dielectrics under stress is investigated. Two types of soft breakdown, digital and analog modes, are observed in HfON gate dielectrics, featuring gate voltage fluctuation accompanying random telegraph noise and nonswitching 1f noise, respectively. The dependence of gate area, oxide thickness, and stress current density on breakdown modes is also studied. Thin oxide thickness and small gate area contribute to the enhancement of charge to breakdown (Qbd). Large Joule heat damage generated under stress inducing the analog soft breakdown for thick hafnium oxynitride films is proposed to clearly understand the breakdown of HfON gate dielectrics.

Original languageEnglish
Article number024503
JournalJournal of Applied Physics
Volume98
Issue number2
DOIs
StatePublished - 15 07 2005
Externally publishedYes

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