Speeding up failure shape analysis for memory diagnosis

Hsing Chung Liang*, Jyh Ming Jang, Hwang Cherng Chow

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

Abstract

A failure shape analysis system is developed to quickly analyze the defect distribution of memories for diagnosis. Compared to the original system, the newer one consists of several programs feasible both on workstations and PCs. The included programs transform and grasp the specific data for further failure analysis. The complete system is highly reliable and fault tolerant for the entire manufacture and test procedure. It can achieve the similar defect distribution as the original system but with only 11% and 6% of run time on workstations and PCs, respectively.

Original languageEnglish
Pages (from-to)634-641
Number of pages8
JournalWSEAS Transactions on Circuits and Systems
Volume4
Issue number6
StatePublished - 06 2005

Keywords

  • Defect cell
  • Fail bit map
  • Fail pattern
  • Failure shape
  • Failure shape analysis
  • Wafer fail bit map

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