Strength evaluation of thin 3D-TSV memory chips by pin-on-elastic- foundation test
- P. S. Huang
- , Y. C. Chao
- , M. Y. Tsai*
- , P. C. Lin
*Corresponding author for this work
- Chang Gung University
- Nanya Technology Corporation
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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