Strength evaluation of thin 3D-TSV memory chips by pin-on-elastic- foundation test

  • P. S. Huang
  • , Y. C. Chao
  • , M. Y. Tsai*
  • , P. C. Lin
    • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

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