Study of high-tech process furnace using inherently safer design strategies (I) temperature distribution model and process effect

Chun Yu Chen*, Kuo Chi Chang, Gwo Bin Wang

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

24 Scopus citations


High-tech industries, such as those producing semiconductor and TFT-LCD (Thin Film Transistor Liquid Crystal Display), have recently become the most important economic activities in Taiwan. Each of these industries has a complete chain of supply from raw material production, production pre-processing, product manufacturing, to waste handling. Any company in the chain is a critical component, since any accidents of fire, explosion, gas leakage, or power outage would cut off the supply chain, causing inability of continuous operation. In industries of semiconductor and TFT-LCD, great amounts of special gases and chemicals with many machinery equipments are used in the production processes. In cases of accidents or improper installation, this chain of supply, from raw material production, preproduction, product manufacturing, to waste handling materials and equipments may cause severe damages or incidents. This study used the existing model of the horizontal furnace to develop a simulation program. The simulation results were consistent with the existing model, and produced even slightly better results on temperature distribution and temperature sensitivity. The simulation model applied on a vertical furnace could provide data on furnace temperature control for industrial use. Meanwhile, this study also deduced actual temperature control and an ISD strategy, which are consistent with design strategy principles. The validation results on the proposed temperature distribution model suggested that the model can be applied in temperature distribution and sensitivity analysis to obtain adjustment and control models for various heating zones. In the case of a single tool, when processing reduction is 60 pieces, switching off the two heating zones can reduce 44% of power output, for a capacity utilization rate of 93.7% for the entire plant. The application of the proposed temperature control model can reduce power consumption by 121.4 kWh. In addition, with the same number of tools, facilities layouts in two cases have an area difference of 41.4775 m2, thus shortening the evacuation time for operators. The experimental results proved that the proposed model has realized the ISD principles of intensification, attenuation, and limitation of effects.

Original languageEnglish
Pages (from-to)1198-1211
Number of pages14
JournalJournal of Loss Prevention in the Process Industries
Issue number6
StatePublished - 2013


  • Attenuation
  • Distribution
  • Inherently safer design
  • Intensification
  • LPCVD furnace
  • Limitation of effects
  • Thermal model of wafer temperature


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