Abstract
A highly improved method to reduce gate-induced drain leakage and retention fail bit counts is proposed for use in the sub-40-nm dynamic random access memory technologies. Fluorine (F) implantation with different dose post-gate oxidation is used for investigating the performance of saddle-fin (S-Fin) array devices. Significantly lower retention fail counts of 35% are achieved in the S-Fin device using a medium dosage of F implantation. Random telegraph signal-like fluctuation can also be improved using the proposed F implantation method. Trap passivation by F atoms in the source and the drain areas could have led to the improvements seen in the experiments.
Original language | English |
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Article number | 6553604 |
Pages (from-to) | 1124-1126 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 34 |
Issue number | 9 |
DOIs | |
State | Published - 2013 |
Keywords
- Dynamic random access memory (DRAM)
- fluorine (F) implantation
- gate-induced drain leakage (GIDL)
- retention