The Changing Physics in Metal Interconnect Reliability

Cher Ming Tan; Yuejin Hou

doi:10.1002/9781118056776.ch14

The Changing Physics in Metal Interconnect Reliability

Cher Ming Tan^*, Yuejin Hou

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

2 Scopus citations

Original language	English
Title of host publication	Ceramic Integration and Joining Technologies
Subtitle of host publication	From Macro to Nanoscale
Publisher	John Wiley and Sons
Pages	415-447
Number of pages	33
ISBN (Print)	9780470391228
DOIs	https://doi.org/10.1002/9781118056776.ch14
State	Published - 24 10 2011
Externally published	Yes

Keywords

Failure mechanism
Integrated chip
Metal interconnect reliability
Packaging/systems
Physics

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10.1002/9781118056776.ch14

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title = "The Changing Physics in Metal Interconnect Reliability",

keywords = "Failure mechanism, Integrated chip, Metal interconnect reliability, Packaging/systems, Physics",

author = "Tan, {Cher Ming} and Yuejin Hou",

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language = "英语",

isbn = "9780470391228",

pages = "415--447",

booktitle = "Ceramic Integration and Joining Technologies",

publisher = "John Wiley and Sons",

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AU - Tan, Cher Ming

AU - Hou, Yuejin

PY - 2011/10/24

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KW - Failure mechanism

KW - Integrated chip

KW - Metal interconnect reliability

KW - Packaging/systems

KW - Physics

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DO - 10.1002/9781118056776.ch14

M3 - 章节

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SN - 9780470391228

SP - 415

EP - 447

BT - Ceramic Integration and Joining Technologies

PB - John Wiley and Sons

ER -

The Changing Physics in Metal Interconnect Reliability

Keywords

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