The demonstration of recessed anodes algan/gan schottky barrier diodes using microwave cyclic plasma oxidation/wet etching techniques

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Abstract

This paper presents the recessed anodes AlGaN/GaN Schottky barrier diodes (SBDs) using cyclic microwave plasma oxidation and wet etching techniques which were investigated to reduce the damage and contamination on the recessed GaN-based surface. Wide bandgap Ga-doped MgZnO (GMZO) sidewall layer structure was also conducted to suppress the hard breakdown mechanism at high reserve voltage. The SBD with recessed anodes and GMZO sidewall structure had specific on-resistance (RON-SP) of 1.99 mΩ-cm2, turn-on voltage (VON) of 0.40 V, and breakdown voltage of 465 V. The SBDs in this study realized higher RON-SP and lower VON than that of the conventional device. In addition, the reverse recovery and low frequency noise characteristics of SBD with recessed anode and GMZO sidewall structure were lower than those in conventional structure because of the anode metals are close to a high-density 2DEG by using recessed structure and the leakage current from the etching damages is declined by using GMZO sidewall structure.

Original languageEnglish
Title of host publicationWiPDA Asia 2019 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728121451
DOIs
StatePublished - 05 2019
Event2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2019 - Taipei, Taiwan
Duration: 23 05 201925 05 2019

Publication series

NameWiPDA Asia 2019 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia

Conference

Conference2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2019
Country/TerritoryTaiwan
CityTaipei
Period23/05/1925/05/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Keywords

  • Gan
  • Mgzno
  • Microwave plasma oxidation
  • Recessed anode
  • Schottky barrier diode
  • Wet etching

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