The Reflectivity Enhancement of Ni/Ag/M/Au Ohmic Contact for Flip-Chip Light-Emitting Diode Applications

Research output: Contribution to conference › Proceeding

Original language	American English
State	Published - 2007
Event	2007,15th IEEE International Conference on Advanced Thermal - Catania, Italy Duration: 02 10 2007 → 05 10 2007

Conference	2007,15th IEEE International Conference on Advanced Thermal
Period	02/10/07 → 05/10/07

Cite this

@conference{68f69a56967a4b60bce0f41013aa76bc,

title = "The Reflectivity Enhancement of Ni/Ag/M/Au Ohmic Contact for Flip-Chip Light-Emitting Diode Applications",

author = "Liann-Be Chang and Ching-Chuan Shiue and Ming-Jer Jeng",

year = "2007",

language = "American English",

note = "2007,15th IEEE International Conference on Advanced Thermal ; Conference date: 02-10-2007 Through 05-10-2007",

}