Abstract
In this paper, NH3 plasma directly applied to the surface of poly-Si channel is studied for the development of high-performance low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) with HfO2 high-\kappa gate dielectric. The reduction of threshold voltage from 1.52 to 0.62 V, the decrease of subthreshold swing from 227 to 151 mV/decade, and the enhancement of field effect mobility μ FE from 31 to 65 cm 2/Vs are observed after NH3 plasma surface treatment. It can be attributed to the NH3 plasma surface treatment enabling defect passivation and plasma-induced interfacial layer (PIL) growth. To decouple the impacts of defect passivation and PIL growth, the device without PIL is also fabricated. This paper demonstrates the important impacts of NH3 plasma surface treatment on the improvement of electrical characteristics of LTPS-TFTs.
| Original language | English |
|---|---|
| Article number | 6893002 |
| Pages (from-to) | 3722-3725 |
| Number of pages | 4 |
| Journal | IEEE Transactions on Plasma Science |
| Volume | 42 |
| Issue number | 12 |
| DOIs | |
| State | Published - 01 12 2014 |
| Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2014 IEEE.
Keywords
- Interfacial layer
- low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs)
- NH
- plasma passivation
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