Transient electrical thermal analysis of ESD process using 3-D finite element method

Yuejin Hou*, Cher Ming Tan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future.

Original languageEnglish
Title of host publicationISIC-2009 - 12th International Symposium on Integrated Circuits, Proceedings
Pages129-132
Number of pages4
StatePublished - 2009
Externally publishedYes
Event12th International Symposium on Integrated Circuits, ISIC-2009 - Singapore, Singapore
Duration: 14 12 200916 12 2009

Publication series

NameISIC-2009 - 12th International Symposium on Integrated Circuits, Proceedings

Conference

Conference12th International Symposium on Integrated Circuits, ISIC-2009
Country/TerritorySingapore
CitySingapore
Period14/12/0916/12/09

Keywords

  • Electrostatic discharge
  • Finite element method

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