@inproceedings{32b197741fc84ab9a75ddd4d0ced350f,
title = "Transient electrical thermal analysis of ESD process using 3-D finite element method",
abstract = "In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future.",
keywords = "Electrostatic discharge, Finite element method",
author = "Yuejin Hou and Tan, {Cher Ming}",
year = "2009",
language = "英语",
isbn = "9789810824686",
series = "ISIC-2009 - 12th International Symposium on Integrated Circuits, Proceedings",
pages = "129--132",
booktitle = "ISIC-2009 - 12th International Symposium on Integrated Circuits, Proceedings",
note = "12th International Symposium on Integrated Circuits, ISIC-2009 ; Conference date: 14-12-2009 Through 16-12-2009",
}