Ultrasonic sensors and techniques for semi-solid die casting processes

J. F. Moisan, C. K. Jen, J. W. Liaw, T. F. Chen, Z. Sun, C. A. Loong

Research output: Contribution to journalJournal Article peer-review

Abstract

An ultrasonic clad buffer rod sensor embedded in the die has been used to monitor the semi-solid aluminum die casting process. The sensor was provided with a water cooling system. A multiple recording technique was used for the data acquisition. This single ultrasonic probe monitored the end of die filling, the release of the pressure, the opening of the die, part detachment and solidification of the part. The average temperature in the die and the part, and the ultrasonic velocity and loss in the part were also measured.

Original languageEnglish
Pages (from-to)483-487
Number of pages5
JournalProceedings - IEEE Ultrasonics Symposium
Volume1
DOIs
StatePublished - 2000
Externally publishedYes

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