Vertical GaN Schottky barrier diodes with ohmic contact on N-polar by the atomic layer deposition of aluminum oxide interfacial layer

  • Yongkai Yang
  • , Zhengweng Ma
  • , Zhongwei Jiang
  • , Bo Li
  • , Linfei Gao
  • , Shuai Li
  • , Qiubao Lin
  • , Hezhou Liu
  • , Wangying Xu
  • , Gaopan Chen
  • , Chunfu Zhang
  • , Zhihong Liu
  • , Hsien Chin Chiu
  • , Hao Chung Kuo
  • , Jin Ping Ao
  • , Xinke Liu*
  • *Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

2 Scopus citations

Abstract

In this paper, high-performance vertical GaN on GaN Schottky Barrier Diodes (SBDs) on 2-inch free-standing (FS)-GaN is presented with the specific on-state resistance (Ron) of 1.34 mΩ·cm2, breakdown voltage (Vbr) of 1150 V and figure of merit (FOM) of 0.98 GW/cm2. He-implanted edge termination (ET) structure is introduced to alleviate the peak electric field concentration effect at the anode edge of GaN SBDs. Furthermore, A new ohmic contact structure is explored by atomic layer deposition (ALD)-grown AlOx interfacial layer. Based on the self-cleaning effect of ALD and Ultra-thin AlOx interfacial layer, the Fermi-level Pinning (FLP) effect is alleviated effectively, the specific contact resistivity (ρc) on N-polar GaN was reduced from 1.63 × 10−3 to 7.14 × 10−5 Ω·cm2.The temperature variation test demonstrate the devices has potential of temperature sensors under high voltage and high temperature.

Original languageEnglish
Article number161268
JournalApplied Surface Science
Volume679
DOIs
StatePublished - 15 01 2025

Bibliographical note

Publisher Copyright:
© 2024 Elsevier B.V.

Keywords

  • AlO interfacial layer
  • GaN-on-GaN
  • N-polar
  • Ohmic contact
  • Vertical SBDs

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